We follow the Golden rule and adhere to the principles of IP values and IP protection. A confidentiality agreement (or non-disclosure agreement) is often the first document prepared in the service request process which imposes obligations on the parties during the negotiation period.
MEMS, CMOS, MMIC, Photonics, Graphene, Nanowires, PV Solar & more..
Metal Deposition Al, Ti, Cu, Ag, Ni, ITO and more. Au and Pt Extra.
Dry and Wet Oxidation, POCL3, BBr3 depositions. RTP and furnace anneal and activation & more..
Plasma and Thermal ALD. Low temperature, Flexible substrates. AlOx,TiO2, HFO2, ZnOx, TaO5 & more..
RCA cleans, Nitride and Oxide etch, Non metal and Metal etch.TMAH Si - Texturing. Resist strip & more..
PECVD, CCP-PECVD, ICP-PECVD, TEOS, BPSG, MOCVD, LTO , LPCVD & more..
5 X 5 Chrome Mask with 5um resolution
AFM surface roughness, Woolam Spectroscopy, RI measurements, stress and particle size & more..
Vander-Pauw, 4-point contact resistance measurements, SEM, FIB cross sections & more..
Metal ( Au, Ag, Pt, Ti and more) contact lift offs, Liftoff Ebeam and Contact Mask process & more..
Raith E-beam with 50 nm lateral resolution, E-beam liftoff design and process support & more..
ASML i-line steppers with 1 um lateral resolution, Front and Back Aligners 3 um resolutions & more..
Price may change depending on the tool availability. Shipping cost and state tax may apply.
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