prototype and foundry services
Circuit Design, Mask Making and Lithography
- UV and contact photolithography.
- Direct laser writer with 2 Micron resolution.
- Mask writer with 3 micron resolution on Chrome mask, UV contact aligners with 2 Micron resolution.
- Stepper & Aligner :
- ASML i-line stepper mask and high yield litho process of 1 Micron lateral resolution. Mask layout engineering, Synthesis and Verification.
- E-Beam lithography :
- E-beam lithography with 20 Nanometer end to end resolution.
- Full cycle Metal Liftoff devices.
- Mask Layout Design :
- LRC VRC CRC checksum and correction for GDS II foundry mask file conversion.
- Layout design for 4-point probe structure and van der paum test structures to extract Sheet resistance, Contact chain, Contact resistance. Continuity and channel Isolation.
- Test and pad structure design to extract Threshold Voltages, Transconductance, Body effect, Channel doping simulation.
Fabrication and Process Integration
- Wet Etch Solutions:
- RCA Cleans, Metal etch.
- KOH, TMAH Wafer Texturing, Oxy-Nitride and HF Vapor etch.
- Resist polymer strip.
- Solvent solutions bench for lift offs.
- Other standard and non standard wet chemistry.
- Dry Etch Bay :
- Reactive Ion Etch, Deep RIE and Bosch.
- CCP and ICP Plasma passivation etch.
- ICP Metal Etcher and oxy nitride dry etches.
- Al, Al-Si, SiO2, SiN,Ti, TiN, W, Poy Si, Metal, InGaP, GaN, AlGaN and passivation etch.
- Reactive Ion Etcher and ion mill for contact dry etch and TEM and FEI sample preparation.
- Available gases : Ar, BCl3, CF4, Cl2, Sf6, CHF3, CF4, HBr, NF3, and O2. Surface O2 descum. Resist asher and strippers.
- Oxidation, Diffusion, RTP and Furnaces :
- Dry and Wet Oxidation, ambient gas, Vacuum furnaces.
- Solar and CMOS POCL3 and BBr3.
Thin Films, ALD and Packaging Services
- Thin Films Metalization :
- E-beam Evaporator.
- RF, Dual RF/DC Sputter.
- DC Magnetron Sputter.
- Pulsed Laser Deposition.
- Thermal evaporator.
- Common metals and Metal Oxide includes: Al and Al2O3, Cr and Cr2O3, Pt, Si, Ti, TiOx, Ru, ZrO2 and ITO.
- Plasma and Thermal Atomic Layer depositions :
- Low temperature, Flexible substrates.
- Films: AlOx,TiO2, HFO2, ZnOx, TaO5, Ga2O3 and more.
- Inkjet Electronics Printer for liquid metal inks, contacts on Silicon and flexible substrates.
- Dicing, Bonding, Polishing and Micro Electronics Packaging :
- 4 to 6 inch wafer dice for Silicon, Glass, Quartz and bonded wafers, with protective resist coat.
- Low volume multi layer optoelectronics prototyping .
- Laser bar and diode bonding with Indium, Gold and Tin. Glueing, curing between Silicon dies and glass.
- Anodic bonding on 4 inch to pieces, with 0.5 micron accuracy alignment.
Metrology and In-Line Characterization
- Spectroscopic Ellipsometry for thickness and optical properties ( n, K values) for single to multilayer thin films. Thickness 3D mapping and needed application.
- In line 20 X to 500 X digital optical and dark field microscopes.
- Metrology Atomic Force Microscopy for step height, Plasma treated surface roughness measurements.
- Profilometer Step height and 3D surface mapping.
- Optical reflectometer for Resist, Polysilicon thickness.
- 4-point Sheet resistance mapping.
- Stress tester for tensile, compressive stress analysis.
- Tabletop Scanning Electron Microscope SEM.
- Atomic Force Microscope AFM.
- Digital high resolution optical microscopes.
- Laser Doppler Vibrometer LDV
- Focused Ion Beam apex cuts FIB
- Contact Angle Measurement.
- Ellipsometry and nanospec reflectometer.
- Profilometer, 3D-Step height mapping.
- Particle Count Tester.
Non Disclosure Agreement and IP Protection
We follow the Golden rule and adhere to the principles of IP values and IP protection. A confidentiality agreement (or non-disclosure agreement) is often the first document prepared in the service request process which imposes obligations on the parties during the negotiation period.