NANOSCIENCE TECHNOLOGIES

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NANOSCIENCE TECHNOLOGIES

NANOSCIENCE TECHNOLOGIESNANOSCIENCE TECHNOLOGIESNANOSCIENCE TECHNOLOGIES
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prototype and foundry services

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Circuit Design, Mask Making and Lithography

  • UV and contact photolithography. 
  • Direct laser writer with 2 Micron resolution.
  • Mask writer with 3 micron resolution on Chrome mask, UV contact aligners with 2 Micron resolution.
  • Stepper & Aligner : 
  • ASML i-line stepper mask and high yield litho process of 1 Micron lateral resolution. Mask layout engineering, Synthesis and Verification.
  • E-Beam lithography : 
  • E-beam lithography with 20 Nanometer end to end resolution.  
  • Full cycle Metal Liftoff devices. 
  • Mask Layout Design : 
  • LRC VRC CRC checksum and correction for GDS II foundry mask file conversion.  
  • Layout design for 4-point probe structure and van der paum test structures to extract Sheet resistance, Contact chain, Contact resistance. Continuity and channel Isolation.
  • Test and pad structure design to extract Threshold Voltages, Transconductance, Body effect, Channel doping simulation. 

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Fabrication and Process Integration

  • Wet Etch Solutions: 
  • RCA Cleans, Metal etch.
  • KOH, TMAH Wafer Texturing, Oxy-Nitride and HF Vapor etch.  
  • Resist polymer strip. 
  • Solvent solutions bench for lift offs. 
  • Other standard and non standard wet chemistry. 
  • Dry Etch Bay : 
  • Reactive Ion Etch, Deep RIE and Bosch.
  • CCP and ICP Plasma passivation etch. 
  • ICP Metal Etcher and oxy nitride dry etches. 
  • Al, Al-Si, SiO2, SiN,Ti, TiN, W, Poy Si, Metal, InGaP, GaN, AlGaN and passivation etch. 
  • Reactive Ion Etcher and ion mill for contact dry etch and TEM and FEI sample preparation.
  • Available gases : Ar, BCl3, CF4, Cl2, Sf6, CHF3, CF4, HBr, NF3, and O2. Surface O2 descum. Resist asher and strippers.  
  • Oxidation, Diffusion, RTP and Furnaces : 
  • Dry and Wet Oxidation, ambient gas, Vacuum furnaces.
  • Solar and CMOS POCL3 and BBr3.

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Thin Films, ALD and Packaging Services

  • Thin Films Metalization : 
  • E-beam Evaporator. 
  • RF, Dual RF/DC Sputter.
  • DC Magnetron Sputter. 
  • Pulsed Laser Deposition.
  • Thermal evaporator.
  • Common metals and Metal Oxide includes: Al and Al2O3, Cr and Cr2O3, Pt, Si, Ti, TiOx, Ru, ZrO2 and ITO. 
  • Plasma and Thermal Atomic Layer depositions : 
  • Low temperature, Flexible substrates.
  • Films: AlOx,TiO2, HFO2, ZnOx, TaO5, Ga2O3 and more. 
  • Inkjet Electronics Printer for liquid metal inks, contacts on Silicon and flexible substrates. 
  • Dicing, Bonding, Polishing and Micro Electronics Packaging : 
  • 4 to 6 inch wafer dice for Silicon, Glass, Quartz and bonded wafers, with protective resist coat. 
  • Low volume multi layer optoelectronics prototyping .
  • Laser bar and diode bonding with Indium, Gold and Tin. Glueing, curing  between Silicon dies and glass. 
  • Anodic bonding on 4 inch to pieces, with 0.5 micron accuracy alignment.  

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Metrology and In-Line Characterization

  • Spectroscopic Ellipsometry for thickness and optical properties ( n, K values) for single to multilayer thin films. Thickness 3D mapping and needed application. 
  • In line 20 X to 500 X digital optical and dark field microscopes.
  • Metrology Atomic Force Microscopy for step height, Plasma treated surface roughness measurements. 
  • Profilometer Step height and 3D surface mapping.
  • Optical reflectometer for Resist, Polysilicon thickness.
  • 4-point Sheet resistance mapping.
  • Stress tester for tensile, compressive stress analysis. 
  • Tabletop Scanning Electron Microscope SEM.
  • Atomic Force Microscope AFM. 
  • Digital high resolution optical microscopes.
  • Laser Doppler Vibrometer LDV
  • Focused Ion Beam apex cuts FIB 
  • Contact Angle Measurement.
  • Ellipsometry and nanospec reflectometer. 
  • Profilometer, 3D-Step height mapping.
  • Particle Count Tester. 

Non Disclosure Agreement and IP Protection

We follow the Golden rule and adhere to the principles of IP values and IP protection. A confidentiality agreement (or non-disclosure agreement) is often the first document prepared in the service request process which imposes obligations on the parties during the negotiation period. 

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Fabrication and Packaging Service

Process Integration

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MEMS, CMOS, MMIC, Photonics, Graphene, Nanowires, PV Solar & more..

Thin Film Coatings

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Metal Deposition Al, Ti, Cu, Ag, Ni, ITO and more. Au and Pt Extra.  

Oxide and Nitride wafers

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Dry and Wet Oxidation, POCL3, BBr3 depositions. RTP and furnace anneal and activation & more..

Atomic layer Deposition

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Plasma and Thermal ALD. Low temperature, Flexible substrates. AlOx,TiO2, HFO2, ZnOx, TaO5 & more..

Wet Etch and Texturing

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RCA cleans, Nitride and Oxide etch, Non metal and Metal etch.TMAH Si - Texturing. Resist strip & more..

PECVD Depositions

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PECVD, CCP-PECVD, ICP-PECVD, TEOS, BPSG, MOCVD, LTO , LPCVD & more.. 


Lithography, Mask and Metrology Services

Mask Fabrication

$ 400/Unit

5 X 5 Chrome Mask with 5um resolution 

Metrology Measurements

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AFM surface roughness, Woolam Spectroscopy, RI measurements, stress and particle size & more.. 

In-Line Metrology and FA

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Vander-Pauw, 4-point contact resistance measurements, SEM, FIB cross sections & more.. 

Full cycle Lift Off Process

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Metal ( Au, Ag, Pt, Ti and more) contact lift offs, Liftoff Ebeam and Contact Mask process & more..

E-Beam Lithography

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Raith E-beam with 50 nm lateral resolution, E-beam liftoff design and process support & more..

Stepper and Contact Alligners

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ASML i-line steppers with 1 um lateral resolution, Front and Back Aligners 3 um resolutions & more..

Price may change depending on the tool availability. Shipping cost and state tax may apply.

Copyright © 2020 Nanoscience Technologies Inc. Sacramento,CA,USA. All rights reserved. 

  • FABRICATION & DESIGN
  • FAILURE ANALYSIS
  • CHARACTERIZATION
  • ElECTRICAL MEASUREMENTS
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  • CONTACT US

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