Materials Failure Analysis
There is often a need to prove the technology worthy before a large investment can be made. Our goal is to achieve high standard results with straightforward communication and consistent on-time deliveries. Our staff are ready to help you determine the root cause, so that the solutions can be developed quickly, preventing further failures and reducing downtime racing your goals.
X-Ray Photon Spectroscopy
Scanning Electron Microscopy
Scanning Electron Microscopy
- XPS Quantitative analysis and depth profiling of dopants and impurities in semiconductor substrates and thin films.
- Fingerprinting contaminants on magnetic hard disc
- Surface mapping elements and molecules.
- Identifying and determining crosslinking in polymers and organic surfaces.
Scanning Electron Microscopy
Scanning Electron Microscopy
Scanning Electron Microscopy
- SEM Failure Analysis and Reverse engineering.
- Grain Size, Sample cross section and step height.
- Surface morphology and Defect studies.
- Biological Samples.
- Grain size analysis and distribution.
- EDX Chemical and surface contamination mapping.
- Grain boundary, inclusion fingerprinting and analysis.
Focused Ion Beam
Scanning Electron Microscopy
Focused Ion Beam
- FIB Device reverse engineering & tomography.
- Ion Beam, E-Beam Pt,W & Carbon deposition and Ion Beam Milling.
- FIB Failure analysis on memory arrays.
- Thin film coatings and plating thicknesses
- Elucidate a specific IC structure and hotspot investigation.
- Process Nodes Reverse engineering
- Circuit edit Single Beam FIB (Back-Side and Top-Side)
FTIR
X-ray Diffraction and Fluorescence
Focused Ion Beam
- Nano characterization and contamination fingerprinting.
- Identification of complex mixtures of materials, gases, thick films, liquids and solid polymer and polymer blends.
- Surface analysis for analysis of adhesives, coatings and polymer adhesions.
Transmission Electron Microscope
X-ray Diffraction and Fluorescence
X-ray Diffraction and Fluorescence
- Surface and interface Topography and Morphology.
- SAED compositional and crystalline information.
- Crystal defect and nanometer scale and elemental maps characterization.
- Material Science studies of dislocations, grain boundaries, voids, stacking faults.
X-ray Diffraction and Fluorescence
X-ray Diffraction and Fluorescence
X-ray Diffraction and Fluorescence
- XRD XRF for Determining quantitative phase composition, Lattice parameters, Alloy composition.
- Identification and quantification of crystalline phase, Doping concentration, Grain residual strain.
- Investigation of Crystal structure, Texture orientation, Rocking curve and X-ray reflectivity measurements.
Device, PCB and IC Failure Analysis
We offer semiconductor failure analysis for determining the physical root cause of component failure, given the electrical failure mode and characteristics. To accomplish this, we combine a series of electrical and physical steps aimed at localizing and identifying the ultimate cause of failure.
Scanning Acoustic Microscope
Scanning Acoustic Microscope
Scanning Acoustic Microscope
- C-SAM failure analysis on PCB for Interfacial delamination, Inter connects Joint, bonding, aseal analysis and Void detection.
- Printed circuit board anomalies, Encapsulated IC packages, PCB reverse engineering, Wafer bonding, PCB lamination, Ceramic packaging encapsulants, Interconnect via metal layers and Medical devices.
- A-Scan Mode (Amplitude Scan).
- C-Scan Mode (Confocal Scan).
- Through-Scan Mode.
FA Analysis Support
Scanning Acoustic Microscope
Scanning Acoustic Microscope
- Chemical Decapsulation and Global Isolation test.
- Printed circuit board anomalies, Encapsulated IC packages, PCB reverse engineering.
- Package Assembly and Failure Analysis support related services.
- Wafer bonding, PCB lamination, Ceramic packaging encapsulants, Interconnect via metal layers and Medical devices.
- High Temperature Operating Life, Temperature Humidity Bias testing.
- Highly Accelerated Stress Bias Testing (HAST).
- Temperature Cycling.
RF Test Bench Measurements:
IV, CV Measurement and Curve tracer:
IV, CV Measurement and Curve tracer:
- Determine Time -Domain -Gating mode measurements.
- Pulsed RF, Return Loss, Impedance, Insertion Loss.
- Measurement and failure analysis Transmission Coefficient.
- Frequency conversion, S-Parameter extraction.
- Antenna, Smith chart and signal integrity measurements.
IV, CV Measurement and Curve tracer:
IV, CV Measurement and Curve tracer:
IV, CV Measurement and Curve tracer:
- CV Impedance Dissipation factor on passive components.
- Mobile ion studies, SiOx and SiNx layer integrity.
- Determine breakdown voltages and IV's.
- Measurement of resistance,Capacitance, Carrier Recombination, Metal Insulator Metal profiles.
Terms & Conditions
We grow our business in a way that makes us proud and we communicate fearlessly to build that trust. We understand that on-time delivery is essential to our customer’s requirements. We’ve built our reputation on fast, accurate, on-time delivery of customer’s needs. The date promised is the date delivered.
Material Failure Analysis
Focused Ion Beam FIB
Apex cuts, Ion beam, Device reverse engineering Structure cuts and tomography & more..
Secondary Electron Microscope SEM
Cross sections, Surface profile failure analysis, Grain size and elementantal compositions EDAX & more..
X-Ray Photon Spectroscopy XPS
Organic, Inorganic,Thin film binding energy extraction, Surface elemental composition fingerprinting & more..
Fourrier and IR Spectroscopy FTIR
Material identification and fingerprinting, Surface analysis of liquids, polymers, adhesives, coatings and particle analysis & more..
X-ray Diffraction and Fluorescence XRD-XRF
2 theta scans, rocking curve analysis, Phase composition, residual strain and texture orientation measurements & more..
Transmission Electron Microscopy TEM
Surace SAED, Cryo-TEM, HRTEM elemental composition, Cross section and dislocation studies and measurements & more..
Electrical Failure Analysis
Scanning Acoustic Microscope C- SAM
PCB QA & FA Delamination, Inter connects, Die bonding and packaging laminations and more..
DC-Probe Station test bench
Semiconductor device parameter analysis Id-Vd, Id-Vg, Transconductage, Threshold and Mobility measurements & more..
RF-Probe Station test bench
Smith chart, Time-Domain-Gating, Pulsed RF, Return Loss, Impedance Insertion loss measurements & more..
IV-CV Curve tracer device parameter measurements
CV-Impedance, Dissipation of active and passive components, MIM, Mobile ion and Breakdown studies & more..
Price may change depending on the tool availability. Shipping cost and state tax may apply.
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